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BGA封装 老化座/测试插座

   

3M Textool 1.27 mm pitch, Open Top, BGA Test & Burn-In Sockets

Types II, III
Double-beam, normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress. Includes unique Micro- wiping effect
Contact tips touch ball above it's center plane producing only slight indentations and minimal ball deformation.
Allows excellent air flow around device.
Includes a retractable locating guide for easy
board mounting even with hundreds of leads.
Compatible with most robotic handlers while it
provides easy manual operation.

Type Device Size Matrix
II 35mm Square 27 X 27
III 45mm Square 35 X 35

 

Date Issued: December 13, 2002 TS-9200-07
Sheet 1 of 3

Body:
Material: Polyethersulfone (PES)
Flammability: UL 94V-0
Color: Black
Alignment Plate:
Material: Liquid Crystal Polymer (LCP)
Flammability: UL 94V-0
Color: Black
Material: Beryllium CopperPlating:30 m" (0.76 mm) Gold over 50 m" (1.3 mm) Nickel
Marking:3M Logo/Textool

Electrical

Insulation Resistance: >1000MW at 500 Vdc
Dielectric Withstanding Voltage: 500 Vrms at Sea Level
Initial Contact Resistance: <50mW measured at 1.0 mA applied current
Current Rating: 0.5 A max @ 25Cred at 1.0 mA applied current

Environmental
Operating Temperature Rating: - 55 C to + 150 C

MechanicalD

urability: 20,000 actuations (10,000 devices load/unload) at room temperature.Initial Contact Force: 17gf (0.17N) Nom
Initial Actuation Force:

Type II – 2.5Kg Max @ 352 pin count 3.8Kg Max @ 480 pin count
Type III – 7Kg Max @ 540 pin count
3.8Kg @ 900 pin count
Contact Wiper Gap - Fully Open: 1.05mm Nom